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Replacement Pads for Smt Components On Printed Circuit Boards

IP.com Disclosure Number: IPCOM000101401D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

McMorran, J: AUTHOR

Abstract

This method reduces the scrap rate of printed circuit boards due to damaged pads, by replacing the damaged pads with a flexi-circuit patch that allows rework of the card to an "as new" condition.

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This is the abbreviated version, containing approximately 100% of the total text.

Replacement Pads for Smt Components On Printed Circuit Boards

       This method reduces the scrap rate of printed circuit
boards due to damaged pads, by replacing the damaged pads with a
flexi-circuit patch that allows rework of the card to an "as new"
condition.

      Surface Mounting Technology (SMT) printed circuit boards that
suffer damaged surface-mount solder pads are either scrapped or
repaired by adding wires which are lap-jointed onto the component
leads.

      Disclosed and shown in the figure is a repair method which
employs reproduced images of the pattern 4 of SMT components of a
circuit board 1 onto a flexi-circuit 3 which, in turn, is attached by
adhesive 5 over the damaged pads 2.  The new leads 6 are then
soldered or welded into place.  The SMT components can now be
soldered to the pads as normal and, if necessary, removed again in
further operations without damage to the pads or impact on
reliability.  Adhesive 5 can be part of the underside of the
flexi-circuit 3 as a self-adhesive layer or applied separately.