Browse Prior Art Database

Technique for Thermally Enhancing Tab

IP.com Disclosure Number: IPCOM000101462D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 76K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR [+2]

Abstract

A method is described for thermally enhancing a Tape Automated Bonding (TAB) component to a thermally conductive surface on a card cover using a spring-activated pin through a hole in the card which is directly beneath the center of the TAB device.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 70% of the total text.

Technique for Thermally Enhancing Tab

       A method is described for thermally enhancing a Tape
Automated Bonding (TAB) component to a thermally conductive surface
on a card cover using a spring-activated pin through a hole in the
card which is directly beneath the center of the TAB device.

      The use of a spring-like device is proposed to facilitate heat
transfer from a Tape Automated Bonding (TAB) device to a card cover.
The purpose of this spring-like device is to provide a thermally
conductive connection from the TAB chip to a card cover.  In this
proposal, the spring-like device is mounted to a bottom cover which
is on the opposite side of the circuit card surface where the TAB
device is attached.  This bottom cover may be of a variety of
configurations, but must have the spring-like device concept allows
the designer, for the overall system, the capability and flexibility
to choose the cover technique which satisfies a specific criterion.

      The spring concept shown in Figs. 1 and 2 consists of a bottom
card cover with either (1) a spring-type push pin or (2) a leaf
springtype push pin.  In each case, the spring is built into the
bottom of the top cover through a thin layer of thermally conductive
material such as a thermal tape, grease, or epoxy.  Alternatively,
contact can be made through force alone, although this would not
provide the ultimate thermal path.

      Using the spring and cover concept, heat transfer is expected
to flow...