Browse Prior Art Database

Thermode for "J" Leaded Devices

IP.com Disclosure Number: IPCOM000101468D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Wustrau, R: AUTHOR

Abstract

Within case 5 there resides a free-floating member 1, retained by pin 2 in a slot of member 1. Arm 3 is mounted in a pivotal manner to member 1. Spring 4 biases arm 3 against tapered sleeve 6. Sleeve 6 is contained in case 5. Vacuum tube 7 lifts device 10 from a printed circuit board (PCB) 9 during a desoldering mode.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Thermode for "J" Leaded Devices

       Within case 5 there resides a free-floating member 1,
retained by pin 2 in a slot of member 1.  Arm 3 is mounted in
a pivotal manner to member 1.  Spring 4 biases arm 3 against tapered
sleeve 6.  Sleeve 6 is contained in case 5. Vacuum tube 7 lifts
device 10 from a printed circuit board (PCB) 9 during a desoldering
mode.

      Fig. 1 depicts a neutral condition.  Fig. 2 depicts a working
condition.

      When case 5 is projected in a downward direction, member 1
makes contact with PCB 9, stopping vertical motion of member 1 and
arm 3.  With case 5 continuing in its travel bias, spring 4
collapses.  The radius on arm 3 is forced outward by contact with the
taper on sleeve 6, causing a pivotal motion of arm 3.  Contact of arm
3 against "J" leads of device 10 transfer heat from thermocouple 8
through arm 3 into the "J" leads of device 10, causing solder to
reflow.