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TAB Package Lead Bonding Thermode With Ruby Head

IP.com Disclosure Number: IPCOM000101469D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Wada, T: AUTHOR

Abstract

Disclosed is a thermode for TAB (Tape Automated Bonding) package lead bonding, which comprises a ruby head attached to the thermode body preferably made of molybdenum. The thermode is thermally stable, resistant to abrasion, and prevents deposition of oxide.

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TAB Package Lead Bonding Thermode With Ruby Head

       Disclosed is a thermode for TAB (Tape Automated Bonding)
package lead bonding, which comprises a ruby head attached to the
thermode body preferably made of molybdenum.  The thermode is
thermally stable, resistant to abrasion, and prevents deposition of
oxide.

      A bonding tool, called thermode, is used to bond TAB leads to
chips.  For reliable bonding, the thermode must be resistant to
abrasion and must not cause deformation or distortion in the bonding
surface at the high temperatures at which the bonding is performed.

      The disclosed thermode comprises ruby head 10 attached to
thermode body 12.  The body 12 is preferably made of a material which
has a thermal expansion coefficient substantially matching that of
ruby, such as molybdenum. The thermode is thermally stable and
minimizes deformation of the bonding surface due to the difference
between thermal expansion coefficients of the body and head,
providing high quality bonding.