Browse Prior Art Database

Pin-In-Hole Heat Sink Attachment

IP.com Disclosure Number: IPCOM000101503D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR [+3]

Abstract

A method is described for attaching a heat sink to a circuit board using standard card drilling holes via a pin-in-hole arrangement. Although this technique focuses on a heat sink for a TAB component, it can be extended to other devices which need a heat sink supported by the circuit board.

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Pin-In-Hole Heat Sink Attachment

       A method is described for attaching a heat sink to a
circuit board using standard card drilling holes via a pin-in-hole
arrangement.  Although this technique focuses on a heat sink for a
TAB component, it can be extended to other devices which need a heat
sink supported by the circuit board.

      As shown in Figure 1, four pins are located on the board by
wave solder operations for heat sink 4 attachment. Figure 2 shows a
detailed sketch of the heat sink foot 6 which is held in place by a
pressure fit with a pin.  Pins 2 are placed prior to mounting of a
TAB component 8.  Since pins 2 are small in diameter and height, they
do not interfere with placement of the TAB device.

      The problem solved by the pin-in-hole attachment is twofold.
First, there is a tolerance build-up in the mechanical attachment of
the heat sink.  A loose fit of a heat sink to a TAB device results
in stresses on the Inner Lead Bond (ILB) region of the TAB component
(circuitry between chip and tape.) Secondly, the attachment using
pin-in-hole allows for the heat sink to be attached using standard
processes.

      In addition, the pin-in-hole attachment is also a reworkable
technique and is extendable to thermal enhancement designs for other
than TAB device heat sinks.