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Browse Prior Art Database

High Performance Heat Pipe Thermode System

IP.com Disclosure Number: IPCOM000101509D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Buller, ML: AUTHOR [+2]

Abstract

A method is described for attaching surface mount components using thermode or hot air reflow systems. The hardware presently being used can be enhanced by the inclusion of heat pipe technology to reduce the inherent problem of temperature gradients along the length of the reflow area. The resultant system improves the uniformity of the temperature profile, resulting in a more consistent assembly and higher interconnection yields.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 68% of the total text.

High Performance Heat Pipe Thermode System

       A method is described for attaching surface mount
components using thermode or hot air reflow systems.  The hardware
presently being used can be enhanced by the inclusion of heat pipe
technology to reduce the inherent problem of temperature gradients
along the length of the reflow area. The resultant system improves
the uniformity of the temperature profile, resulting in a more
consistent assembly and higher interconnection yields.

      In the embodiment shown in the figure, the heat pipe transfers
energy to the working region (1) from the input region (2).  Thermal
energy is provided to the input region by techniques such as
resistive heat, hot oil, etc.  The thermal capacity of the input
establishes the delivery to the working region with low thermal
differentials and rapid response time.  These characteristics are
created by the low mass/high transport velocities associated with
heat pipe technologies.  By using a tightly coupled temperature
sensor (3) to create a feedback circuit between the modulation system
(4) and the thermal input (2), fast response and precise control can
be established.  Also incorporated into the thermal modulation system
is a cold sink capability executed in region (5) that is integrated
into the design to thermally manage temperature overshoot and
establish the capability to provide fast cooling response.

      Energy from the main working region (1) can be transferred to
t...