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Cylindrical Honeycomb Core Substrate to Eliminate Package Warpage

IP.com Disclosure Number: IPCOM000101572D
Publication Date: 2005-Mar-16
Document File: 2 page(s) / 118K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a cylindrical honeycomb core impregnated with resin to improve package rigidity and reduce package warpage. Benefits include reducing process costs.

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Cylindrical Honeycomb Core Substrate to Eliminate Package Warpage

Disclosed is a method that uses a cylindrical honeycomb core impregnated with resin to improve package rigidity and reduce package warpage. Benefits include reducing process costs.

Background

The current DLL substrate requires a stiffener to reduce package warpage (see Figure 1); however, this stiffener can create difficulties during the chip, attach, or deflux steps in the assembly process. Additionally, the stiffener reduces the real estate for die side capacitors (DSC). The current implementations are as follows:

§         Using an integrated heat sink (IHS) lid to increase the rigidity of packages and to prevent warpage

§         Using a metal plate to cover the top of the substrate (see Figure 1B)

§         Using a frame or stiffener at the periphery of the package

General Description

The disclosed method uses a highly rigid cylindrical honeycomb structure made of either metal or polymer as the core for the substrate (see Figure 2). The low-flex property of the honeycomb reduces the bending of the substrate, thereby reducing package warpage. The honeycomb structure also reduces the x and y dimension displacement of the substrate that results in lower CTE of the substrate; therefore, it improves assembly processes and reliability performances of the package. The aircraft industry uses this honeycomb structure to obtain highly rigid materials with a very low weight.

The cell width of the honeycomb ranges from 0.1mm to 0.3mm, and the thickness of the honeycomb can vary from 0.25mm to 0.5mm. The cell width and thickness can be manufactured according to package requirements. Since honeycomb...