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Method for an IHS for a high-density memory package stack

IP.com Disclosure Number: IPCOM000101576D
Publication Date: 2005-Mar-16
Document File: 5 page(s) / 268K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated heat spreader (IHS) for a high-density memory package stack. Benefits include improved functionality, improved performance, and improved thermal performance.

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Method for an IHS for a high-density memory package stack

Disclosed is a method for an integrated heat spreader (IHS) for a high-density memory package stack. Benefits include improved functionality, improved performance, and improved thermal performance.

Background

              Memory modules have a limited total number of devices because the surface area is typically laid out in an X-Y pattern. Memory devices are mounted parallel to the module. Thermal management for the device is conventionally a copper/ aluminum cover plate placed directly on top of the memory devices as a common heat spreader. Coupling is thermal interface material (TIM). Rambus dynamic random access memory (RDRAM) and some of the double data rate  (DDRII) modules are typical examples (see Figure 1).

General description

              The disclosed method mounts memory devices vertically to the module plane for increased device density. As a result, more memory devices can be mounted on the module. A vertical heat spreader acts as a heatsink fin to provide maximum thermal performance for increased memory device bandwidth.

Advantages

      The disclosed method provides advantages, including:
•     Improved functionality due to increasing the number of memory devices by mounting the devices vertically
•     Improved performance due to improved thermal performance

•     Improved performance due to increased memory device bandwidth

•     Improved thermal performance due to improving the heat transfer surface area by using the vertical heat spreader as a heatsink fin

•     Improved thermal performance due to sandwiching the IHS with memory devices

Detailed description

      The disclosed method is an IHS for a high-density memory package stack. Memory devices are mounted vertically so more devices can be included in a module. The heat spreader is sandwiched with memory devices, which increases the device heat dissipation capability. As a result, device performance and overall memory bandwidth performance are improved.

      With the disclosed method, a memory device package uses a flexible interposer as the package substrate. The substrate-to-memory interface and the pac...