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Method for a high-impact contactor pogo pin

IP.com Disclosure Number: IPCOM000101577D
Publication Date: 2005-Mar-16
Document File: 3 page(s) / 58K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a high-impact contactor pogo pin. Benefits include improved functionality, improved reliability, and improved cost effectiveness.

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Method for a high-impact contactor pogo pin

Disclosed is a method for a high-impact contactor pogo pin. Benefits include improved functionality, improved reliability, and improved cost effectiveness.

Background

      Down binning or false speed readings can occur during class testing of high-frequency flash devices due to the degradation of the test contactor pogo-pin spring after repeated insertions. The result is yield loss and increased costs.

      A pogo pin is the primary part of a test socket. The pin directly interfaces the product solder balls that establish the electrical connection from the die to the tester for parametric and functional testing. The handler provides the insertion motion and applies pressure to the device package. The pogo-pin spring absorbs the impact energy of the insertion and pressure, causing degradation of the spring’s tension .

      Speed testing is one of the key parameters being checked during class testing. High-frequency flash devices are prone to false speed readings due to test socket issues. The test socket pogo pins have a lower life expectancy on high-frequency flash devices as compared to low-frequency devices. The result is an increase in pogo pin consumption.

      Conventionally, down binning or false speed readings during class testing is resolved by frequently replacing the pin prior to the estimated time of spring degradation. This practice, however, results in the too-high consumption of contactor pogo pins.

Description

      The disclosed method is a high-impact contactor pogo pin. It provides the interface between a solder ball and the test equipment. The mechanical degradation of the pogo-pin spring affects the pin’s ove...