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Method for offset wire bonding on a fine-pitch pad

IP.com Disclosure Number: IPCOM000101582D
Publication Date: 2005-Mar-16
Document File: 3 page(s) / 328K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to provide offset wire bonding on a fine-pitch pad. Benefits include improved functionality and improved reliability.

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Method for offset wire bonding on a fine-pitch pad

Disclosed is a method to provide offset wire bonding on a fine-pitch pad. Benefits include improved functionality and improved reliability.

Background

      Wire-to-wire touching and shorting can occur on a fine-pitch bonding pad with thick gold (Au) wires from the package. With high wire-count packages, capillaries can touch and short, causing the electrical failure of the package and device (see Figure 1). Additionally, wires can touch and short during the wire-boding process (see Figure 2).

 

      Conventional solutions include a visual inspection after wire bonding and a sampling X-ray inspection after the molding process to detect touching wires and shorts.

General description

              The disclosed method is offset wire bonding on a fine-pitch pad. The method enables successful wire bonding at a fine pitch using thick gold wire without wire shorting and no wire touching by wire-bond capillaries.

              The key elements of the disclosed method include:

•             Wire bonder that provides the offset wire bonding position on a silicon die pad

•             High wire-count package with a fine-pitch bond pad package

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to enabling more accurate bonding on a fine-pitch pad
•             Improved reliability due to preventing touching issues and wire shorting, which result in circuit and device fa...