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Browse Prior Art Database

Surface-Mounted Heat Sink Attach for Tab

IP.com Disclosure Number: IPCOM000101598D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 3 page(s) / 69K

Publishing Venue

IBM

Related People

Buller, ML: AUTHOR [+5]

Abstract

A method is described for attaching a heat sink or protective cover to a printed circuit board for use with Tape-Automated Bonding (TAB) devices. However, this technique could also be extended to other devices which need heat sinks or protective covers supported by the circuit board. The surface-mounted attach technique is described in detail for a heat sink but is also applicable to a protective cover.

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This is the abbreviated version, containing approximately 68% of the total text.

Surface-Mounted Heat Sink Attach for Tab

       A method is described for attaching a heat sink or
protective cover to a printed circuit board for use with
Tape-Automated Bonding (TAB) devices.  However, this technique could
also be extended to other devices which need heat sinks or protective
covers supported by the circuit board.  The surface-mounted attach
technique is described in detail for a heat sink but is also
applicable to a protective cover.

      Two similar techniques are described which utilize a snap-fit
concept with either (1) the heat sink providing the mating snap, as
shown in Figs. 1 and 2 or (2) a secondary operation to include the
snap on an existing TAB heat sink design, as shown in Fig. 3.

      Fig. 1 shows a heat sink 1, each leg 2 of which is formed
to provide one portion of a mechanical snap.  The other half of a
metallic snap may be solder reflowed over exposed copper pads 5
placed on circuit card 4.

      An enhanced snap design is show in in Fig. 2 where each of four
legs 6 is surface mounted to the card pads 7 on circuit card 4 and
utilize the same self-centering techniques of small I/O surface mount
devices.  By incorporating for clearing the leads of the device in
the snaps, the bends in the heat sink legs could be removed, creating
the potential for a more mechanically flexible heat sink design at
lower forming costs.

      The snap-fit concept shown in Figs. 1 and 2 may be used with a
protective cap during proc...