Browse Prior Art Database

Design of a Protective Cover for Tape-Automated Bonding Devices

IP.com Disclosure Number: IPCOM000101604D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

Arldt, BD: AUTHOR [+4]

Abstract

Tape-Automated Bonding (TAB) devices in modern electronic packaging are fine-pitch devices with high lead counts on flexible (polyimide) carrier tape. These are attached to a substrate by a hot bar solder reflow technique. Due to the fragile nature of these components, mechanical protection is deemed necessary to prevent damage during post-TAB assembly cleaning, testing and handling.

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This is the abbreviated version, containing approximately 76% of the total text.

Design of a Protective Cover for Tape-Automated Bonding Devices

       Tape-Automated Bonding (TAB) devices in modern electronic
packaging are fine-pitch devices with high lead counts on flexible
(polyimide) carrier tape.  These are attached to a substrate by a hot
bar solder reflow technique.  Due to the fragile nature of these
components, mechanical protection is deemed necessary to prevent
damage during post-TAB assembly cleaning, testing and handling.

      This invention describes a new protective cover design as shown
in Figure 1.  The cover provides adequate open area (A) for efficient
cleaning and the attachment is effected via a positive locking clip
(B).  The cap may be attached by either manual or automatic means.
The transparent nature of the material of construction facilitates
visual inspection of the outer bond area.

      There are several advantages to this design:
1.   Mechanical protection is assured by an improved attachment
scheme.  The proposed attachment provides for a positive attachment
to the substrates shown in Figure 1(A).   The cover may be removed
either manually or by automated means.  The design affords better
protection by providing a smaller amount of open area directly above
the center of the TAB component (C), thus limiting the potential for
handling damage.
2.   Manufacturing the cover from a clear plastic, such as
polycarbonate, and not covering entirely the critical outer lead bond
(OLB) area provides inspect...