Browse Prior Art Database

Tape/Decal Automated Bonding Machine

IP.com Disclosure Number: IPCOM000101685D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Bora, MY: AUTHOR [+4]

Abstract

Disclosed is a machine for making inner lead bonds (ILBs) and outer lead bonds (OLBs) using solder bump reflow or thermocompression bonding methods to interconnect semiconductor devices to flexible printed circuit material known as tape or decal in industry. The machine described is self-aligning at the bond head and is capable of making ILB and OLB with greater control and less set up than available bonders.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 63% of the total text.

Tape/Decal Automated Bonding Machine

       Disclosed is a machine for making inner lead bonds (ILBs)
and outer lead bonds (OLBs) using solder bump reflow or
thermocompression bonding methods to interconnect semiconductor
devices to flexible printed circuit material known as tape or decal
in industry.  The machine described is self-aligning at the bond head
and is capable of making ILB and OLB with greater control and less
set up than available bonders.

      The machine is composed of 5 main parts shown in the figure: a
bonding tool and its holder, a bonding head or ram, a self-aligning
coupling, a substrate holder, and a process holder.

      The bonding tool transmits the force from the bonding head to
the parts being bonded.  The thermode (A') is made of metal, ceramic,
cermet, or other suitable material.  It includes temperature sensors
(B) and can be heated to a predetermined temperature or to follow a
time/ temperature profile.  It also has force and position sensors (C
and D) so that various combinations of time, temperature, force, and
displacement can be measured and controlled.  The thermode also
includes a vacuum pickup (E) for placing or removing a chip or tape
sub-assembly to be bonded or removed (for ILB as well as OLB).  The
coupling (F) between the bonding head and thermode is self-aligning
(e.g., a ball- type mount) to ensure coplanarity of the thermode and
bond elements.

      The bonding head ram (A) is controlled to apply a pre...