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Method for direct chip attachment using thin-film capacitor technology

IP.com Disclosure Number: IPCOM000101708D
Publication Date: 2005-Mar-16
Document File: 4 page(s) / 69K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for direct chip attachment using thin-film capacitor technology. Benefits include improved functionality.

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Method for direct chip attachment using thin-film capacitor technology

Disclosed is a method for direct chip attachment using thin-film capacitor technology. Benefits include improved functionality.

Background

              Power delivery through a low-inductance thin-film capacitor (TFC) is required for substrateless high-power components and direct chip attachment to a motherboard.

              Conventionally, CPUs are attached to the motherboard using a land-grid array (LGA) or pin-grid array (PGA) package and a socket. The package enables the delivery of high-quality components. The package also translates the geometry from die-level to board-level dimensions and houses the capacitors required to meet first-droop and second droop requirements.

              The first droop and second droops are conventionally managed through discrete multilayer capacitors placed on an organic substrate. No low-inductance first droop capacitor in direct chip attach (DCA) mode, exists. If direct chip attachment could be realized, the capacitors would be electrically too far from the die to meet first droop requirements (see Figure 1).

General description

      The disclosed method is a TFC mounted to the die (e.g. using a a ceramic interposer (CIN)), which facilitates test/burn-in and enables direct attach to the motherboard by thermal compression bonding.

      The key elements of the method include:

•             Thin-film capacitor to provide a carrier for test/burn-in and management of first droop requirements for CPUs (in the case of TFC having multilayers of thin film capacitor layers providing sufficient capacitance, further benefit through management of second droop)

•             Direct chip attachment to the motherboard to convert from die-bump pitch to package-bump pitch dimensions, using the following:

              -             Flexible tape mounted between the TFC/interposer and motherboard

              -             Local...