Browse Prior Art Database

Chip Location Means in the C-Paps Machine

IP.com Disclosure Number: IPCOM000101715D
Original Publication Date: 1990-Aug-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Feinstein, P, Jr: AUTHOR [+2]

Abstract

Disclosed is the means by which a chip component is positioned so that it can be accurately placed by the machine. The accuracy of the C-PAPS (Chip Pick and Place Simultaneously) machine is derived from the fixed plate tolerances 1 (Fig. 1). Each of the tube/block assemblies 2 are located in accurately machined holes in the fixed plate. These holes are located from tooling pin reference locations. Also, the circuit board and hence artwork features are located from the same tooling pin locations to minimize tolerances. Finally, the component's position for placement is also determined by a close tolerance machined surface 3 on the fixed plate.

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Chip Location Means in the C-Paps Machine

       Disclosed is the means by which a chip component is
positioned so that it can be accurately placed by the machine.  The
accuracy of the C-PAPS (Chip Pick and Place Simultaneously) machine
is derived from the fixed plate tolerances 1 (Fig. 1).  Each of the
tube/block assemblies 2 are located in accurately machined holes in
the fixed plate. These holes are located from tooling pin reference
locations.  Also, the circuit board and hence artwork features are
located from the same tooling pin locations to minimize tolerances.
Finally, the component's position for placement is also determined by
a close tolerance machined surface 3 on the fixed plate.

      In operation, Figs. 1, 2 and 3 show the position of the slider
4 and shuttle plate 5 in the load position (just after the tube/block
assemblies are loaded into the machine), the chip pickup position and
the chip delivery position, respectively.  In Fig. 1, the slider 4 is
in the load position, which prevents component 6 from falling out of
the tube/block assembly.  In order to feed a chip, Fig. 2 shows the
shuttle plate moved to the right to allow a chip to fall onto the
slider 4 from the tube/block assembly.

      After picking up a chip, Fig. 3 shows the chip moved into
position for placement by the shuttle plate 5.  The chip is pushed
against an accurate location surface 3 on the fixed plate 1 by the
slider.  By pushing the chip against surface 3 on the...