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Method for the metallization by wave soldering of an IHS

IP.com Disclosure Number: IPCOM000101732D
Publication Date: 2005-Mar-16
Document File: 2 page(s) / 24K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the metallization by wave soldering of an integrated heat spreader (IHS). Benefits include improved functionality, improved performance, and improved throughput

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Method for the metallization by wave soldering of an IHS

Disclosed is a method for the metallization by wave soldering of an integrated heat spreader (IHS).  Benefits include improved functionality, improved performance, and improved throughput.

General description

      The disclosed method applies solder or solder alloy on the surface of an IHS using a wave-solder process. The solder deposition can be made thicker than with conventional electroplating processes.

      The key elements of the method include:

•             Immersion of the IHS in a bath of molten solder followed by solidification of metal on the IHS surface

•             Precoating or preplating the IHS so that one surface wets the molten solder and one does not

•             Plating masks that limit the area of solder application on the IHS (optional)

•             Air knives that blow the excess molten solder off the IHS before the solder solidifies

•             Magnetic pump that stirs the molten solder bath (optional)

•             Cooling head on the backside of the IHS during plating (optional)

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to enabling the metallization by wave soldering of an IHS

•             Improved performance due to improved composition control of the deposited layer

•             Improved performance due to improved control of the melting point of the metal alloy

•             Improved throughput due to apply...