Browse Prior Art Database

Folded Stacked Package by Convex Shape Tape

IP.com Disclosure Number: IPCOM000101735D
Publication Date: 2005-Mar-16
Document File: 3 page(s) / 197K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a flex substrate with three side legs to accommodate more dies in a single folded stacked package (FSP). Benefits include eliminating the need to prepare different packages for memory and logic.

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Folded Stacked Package by Convex Shape Tape

Disclosed is a method that uses a flex substrate with three side legs to accommodate more dies in a single folded stacked package (FSP). Benefits include eliminating the need to prepare different packages for memory and logic.

Background

Currently, the assembly process incorporates spacers between two or more functional dies during wire bonding. This prepares two separate packages for logic and memory; the top package accommodates memory and the bottom package accommodates logic (see Figure 1). The connection is made via solder balls.

General Description

The disclosed method allows three memories to be folded and stacked on top of the logic. In addition, it enables the one-time molding of the logic and three memories. The disclosed method achieves a higher package density and a wider range of applications for customers with different product combinations. The disclosed method consists of two core elements: a flex substrate shape (and its placement in the reel), and a one-time molding process for the logic and three memories.

 

The flex substrate has three wide flex legs positioned toward the outside. These three legs accommodate the three memory dies. The connection between the center of the logic and each of the three memories is accomplished through the wider flex tape area (see Figure 2). Figure 3 shows the final product appearance. Each single substrate is allocated alternately to eliminate any loss of flex substrate materials...