Browse Prior Art Database

Package Contained Package for Universal Board Design

IP.com Disclosure Number: IPCOM000101738D
Publication Date: 2005-Mar-16
Document File: 2 page(s) / 43K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a package contained package (PCP) that uses a functional package which contains various packages within it. The inside packages are stacked and interconnected either by flip-chip or wire bonding processes. Benefits include a cost effective solution that enables many functional packages to be integrated into a single package without changing the original form factor.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 67% of the total text.

 

Package Contained Package for Universal Board Design

Disclosed is a method for a package contained package (PCP) that uses a functional package which contains various packages within it. The inside packages are stacked and interconnected either by flip-chip or wire bonding processes. Benefits include a cost effective solution that enables many functional packages to be integrated into a single package without changing the original form factor.

Background

The current process requires frequent changes in the mother board design, due to various combinations of the SCSP. These customized boards lead to higher costs for maintainability, as well as a longer design-to-production lead-time. In addition, the current process (with its multiple individual packages) produces a large footprint on the mother board (see Figure 1). Currently, there is no solution, except to redesign boards to accommodate the various ball counts and form factors.

General Description

The disclosed method’s PCP is a functional package that contains various integrated packages within it. The packages inside are stacked and interconnected either by flip chip or wire bonding processes. The complete package is then over-molded for protection against external damages. The complete package has a universal ball-count and x and y dimensions to create a universal mother board. This eliminates the re-routing of multiple types of mother boards for various ball counts or x-y dimensions. Figure 2 shows a package with two...