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Method for an aluminum capacitor with a sponge-shaped inner electrode

IP.com Disclosure Number: IPCOM000101772D
Publication Date: 2005-Mar-16
Document File: 7 page(s) / 92K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an aluminum capacitor with a sponge-shaped inner electrode. Benefits include improved functionality, improved performance, improved throughput, improved process simplicity, improved design flexibility, and improved cost effectiveness.

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Method for an aluminum capacitor with a sponge-shaped inner electrode

Disclosed is a method for an aluminum capacitor with a sponge-shaped inner electrode. Benefits include improved functionality, improved performance, improved throughput, improved process simplicity, improved design flexibility, and improved cost effectiveness.

Background

              Conventionally, a PC motherboard requires several aluminum decoupling capacitors due to high capacitance. They are located on the CPU socket cavity and the peripheral area. Space in the CPU socket cavity is limited. The total capacitance is expected to increase due to increasing CPU power consumption and higher operating frequency.

      To meet the socket-cavity capacitor requirement, 15 - 20 multilayer ceramic capacitors (MLCCs) are typically placed in the limited socket area, which is approximately 15‑mm (L) x 15‑mm (W) x 7‑mm (H, see Figure 1).

      Several varieties of high-capacitance dense structures can be implemented by applying a unique conductive composition material, such as polymerpoly-ethylenedioxythiophene (PEDT) or TetraCyanoQuiNodimethane (TCNQ). However, the raw material cost is higher than conventional impregnated electrode paper.

      Longer manufacturing process time and yield loss occur during the capacitor assembly process due to multiple parts attachment.

General description

              The disclosed method is a capacitor with an inner electrode that is a sponge-shaped aluminum block with high porous density. The capacitor provides a higher capacitance density, lower equivalent series resistance (ESR), and lower equivalent series inductance (ESL). The structured aluminum capacitor replaces multiple conventional high-frequency decoupling capacitors located in the socket cavity.

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to providing a structured aluminum capacitor that replaces multiple conventional socket-cavity decoupling capacitors
•             Improved performance due to using a high-capacitance, low ESR, and low ESL capacitor

•             Improved throughput due to shortening the manufacturing time

•             Improved process simplicity due to decreasing the number of capacitors

•             Improved design flexibility due to minimizing the surface area required for capacitors

•             Improved cost effectiveness due to using a sponge-structured aluminum capacitor

Detailed description

              The disclosed method is an aluminum capacitor for high-frequency decoupling. The capacitor structure is comprised of the following layers (see Figure 2):

•             Electrical insulator coat

•             Aluminum capacitor

•             Electrical conductive adhesive

•             Sponge-structured aluminum filled with electrode solvent

•             Electrode solvent                                                                 ...