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Method for a TAB plating process for recessed peripheral connector fingers

IP.com Disclosure Number: IPCOM000101773D
Publication Date: 2005-Mar-16
Document File: 3 page(s) / 51K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a tape automated bonding (TAB) plating process for recessed peripheral interface connector fingers. Benefits include improved functionality and improved process simplification.

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Method for a TAB plating process for recessed peripheral connector fingers

Disclosed is a method for a tape automated bonding (TAB) plating process for recessed peripheral interface connector fingers. Benefits include improved functionality and improved process simplification.

Background

      A standardized open architecture for peripheral interconnection requires a break-before-make connection for hot-plugging/hot-swapping printed circuit boards (PCBs). The connector must have gold edge plating on the end of the recessed fingers. However, when conventional TAB plating is performed, residual copper (Cu) remains at the ends of the recessed fingers. A manual process is required to remove the residual Cu from the recessed fingers.

              Conventionally, plating of the finger edges is accomplished using the following steps:

1.           Create traces from the recessed and nonrecessed fingers to the edge of the PCB and remove the residual nibs of Cu
2.           Attach the fingers to the plating bus by a secondary process, such as a manual, laser, or mechanical process

      This procedure is not optimal for high volume manufacturing due to the cost added to board processing.

      Alternatively, perform selective deep-tank gold plating to the connection fingers. This procedure is a complex process that adds multiple process steps and a set of quality issues.

General description

              The disclosed method is a TAB plating process for recessed peripheral interface connector fingers. Recessed and nonrecessed fingers are designed using computer aided design (CAD). All fingers are imaged and plated at the same time. Slots are routed and profiled using the conventional method. The temporary bus plating connection is removed. No residual Cu remains. No additional process steps and no selective plating are required.

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to plating all recessed and nonrecessed fingers at the same time
•             Improved process si...