Browse Prior Art Database

Method for an on-package measurement system for predicting reliability

IP.com Disclosure Number: IPCOM000101775D
Publication Date: 2005-Mar-16
Document File: 3 page(s) / 52K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an on-package measurement system for predicting reliability. Benefits include improved functionality, improved performance, and an improved user experience.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Method for an on-package measurement system for predicting reliability

Disclosed is a method for an on-package measurement system for predicting reliability. Benefits include improved functionality, improved performance, and an improved user experience.

Background

 

      The increasing popularity of consumer electronics and small-form factor units creates new thermal and mechanical environments, such as closed-door entertainment cabinets, which requires new requirements for reliability and new timelines for system replacement. Accurately predicting and understanding failure rates of all processor and chipset systems after the systems are purchased and put into use by customers is problematic. Many usage factors contribute to in-field failures, such as usage intensity and operating temperature. Real-time measurement and storage of failure catalysts enables software to analyze the data and predict life cycle failures related to the true usage environment rather than general failure guidelines.

              Conventionally, manufacturers give general guidelines to predict mean time between failure (MTBF) on the parts of systems. Each part has its own MTBF and the system as a whole is subject to the shortest MTBF. Customers must rely on general failure observances in operating conditions to predict their own system failure when their operating environment may be accelerating the expected failure curve. In some cases, the details of the operating environment that may have lead to the system failure cannot be identified.

General description

      The disclosed method is an on-package measurement system that collects usage data from the central processing unit and chipset, which enables the analysis and more accurate prediction of real-time failures.

              The key elements of the disclosed method include:

•             Nonvolatile storage – Continually stores the measurement data

•             Sensors – Physical temperature sensors and microprocessor coding to track usage characteristics, such as ambient temperature, power cycles, and operations executed

•             Software interface – Capability for software applications to access and analyze the measured data to corre...