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Browse Prior Art Database

Circuit Card Cooling Enhancement Device

IP.com Disclosure Number: IPCOM000101816D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

DeSilva, DK: AUTHOR

Abstract

A circuit card design is described wherein the card is constructed in such a way so as to enhance cooling capabilities. The construction is such that a secondary heat rejection path is created to dissipate heat.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 80% of the total text.

Circuit Card Cooling Enhancement Device

       A circuit card design is described wherein the card is
constructed in such a way so as to enhance cooling capabilities.  The
construction is such that a secondary heat rejection path is created
to dissipate heat.

      As circuit module component densities decrease and power
requirements increase, along with stringent acoustical specification
limits, the volume of air needed to cool the electrical components is
often limited.  The concept described herein provides additional
cooling to the modules mounted on a circuit card through the use of a
thermal conduction path.  This is done through the use of mechanical
interface heat rejecting card guides and frame members.  The concept
is particularly beneficial when used on multi-layered printed circuit
cards due to the increase in power needed.

      When multi-layer circuit card 10, as shown in the figure, is
equipped with modules 11, the primary cooling implementation is
through air passing over modules 11 and pins 12.  To provide a
secondary heat transfer path, circuit card 10 utilizes existing
ground plane 13.  Heat is conducted from ground plane 13 to surface
ground pads 14 by means of plated through holes in the pads.  Ground
pads 14 act as an interface between circuit card 10 and heat-sink
card retainer guides 15.  Card retainer guides 15 are equipped with
extended spring assemblies 16, typically made of beryllium copper.

      When card 10 is inse...