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Improved Cleaving/Mounting Procedure for Laser Chips

IP.com Disclosure Number: IPCOM000101837D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-16
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Gasser, M: AUTHOR [+2]

Abstract

Proposed is a procedure to cleave laser chips in a way which strongly reduces the occurrence of handling-induced failures. In contrast to standard procedures, where mounting is performed after cleavage of the chips, a whole laser bar is mounted first on the submount of a carrier, and cleavage is done as the second step.

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Improved Cleaving/Mounting Procedure for Laser Chips

       Proposed is a procedure to cleave laser chips in a way
which strongly reduces the occurrence of handling-induced failures.
In contrast to standard procedures, where mounting is performed after
cleavage of the chips, a whole laser bar is mounted first on the
submount of a carrier, and cleavage is done as the second step.

      The figure shows a sketch of a laser bar 1 after mounting on
the submount 2 of a carrier 3.  A scratch 4 determines the position
of the cleavage, which is done by applying a force to the bar as
indicated by the arrow (F). The force produces a uniform stress over
the bar, but more important, does not introduce internal stress in
the chip, since it is already completely fixed in its final position.
Furthermore, the ridges defining the laser cavity are not exposed to
external forces.  If present, both of these effects produce damage,
especially in the mirror region, which finally results in failures or
accelerated degradation rates during operation.

      By repetitive application of the above described procedure all
chips on a bar are cleaved and mounted, without exposure to larger
stress.