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Browse Prior Art Database

Solderless Multi-Chip Module Attachment in Vertical Fashion

IP.com Disclosure Number: IPCOM000101865D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Frankeny, JA: AUTHOR [+4]

Abstract

Disclosed is a process that eliminates solder reflow for attach/remove of a multi-chip flexible module from a PC board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solderless Multi-Chip Module Attachment in Vertical Fashion

       Disclosed is a process that eliminates solder reflow for
attach/remove of a multi-chip flexible module from a PC board.

      An array of components, shown in Figs. 1 and 2, allows a
solderless union to be formed between a flexible chip-carrying member
and a PC board.

      Fig. 1 shows a cross section of the latched module, while Fig.
2 shows an exploded view.

      In Fig. 1, item 4 is a HDC substrate that has been bonded onto
stiffner 7.  The substrate is bent around the surface and over
compliant member 5.  This converts the I/O contacts to the bottom of
the module to allow them to be parallel to the contacts on card 1.
Buckling beam contact strips 3 are used to connect the two rows of
pads.

      Fig. 2 shows how the module is assembled.  The housing 2 is
bonded onto the card 1.  Buckling beam strips 3 are dropped into the
slots.  The four chip module is set into place and the snap-on clip 6
is pressed on bending the beams, which makes electrical contact.  The
snap-on clip 6 holds the assembly fixed.