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Aluminum Metallurgy Rework Process

IP.com Disclosure Number: IPCOM000101877D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 22K

Publishing Venue

IBM

Related People

Cook, H: AUTHOR [+9]

Abstract

Aluminum or aluminum alloy metal on titanium over tungsten studs is reworked resulting in good wiring characteristics, including contact resistance to studs. Mistakes at metalization or photo definition of a wiring level without a good rework process available result in losing a large investment in processing large-scale integrated circuits on large wafers.

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Aluminum Metallurgy Rework Process

       Aluminum or aluminum alloy metal on titanium over
tungsten studs is reworked resulting in good wiring characteristics,
including contact resistance to studs.  Mistakes at metalization or
photo definition of a wiring level without a good rework process
available result in losing a large investment in processing
large-scale integrated circuits on large wafers.

      Aluminum or aluminum alloy is first removed by wet etching in a
standard phosphoric/nitric acid etchant.  A chemical mechanical
polish process used normally in planarizing tungsten during the stud
process is then performed.  Polishing is stopped after all titanium
is removed.  Re-metalization with titanium and aluminum is then
performed and photo-wiring definition completes the rework.