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Browse Prior Art Database

Device to Make Ultra Small Diameter Vias in PC Cards

IP.com Disclosure Number: IPCOM000101881D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Driga, M: AUTHOR [+4]

Abstract

Disclosed is a device that allows the making of vias as small as .001 inch in diameter in cards that cannot be done with drilling or punches.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 70% of the total text.

Device to Make Ultra Small Diameter Vias in PC Cards

       Disclosed is a device that allows the making of vias as
small as .001 inch in diameter in cards that cannot be done with
drilling or punches.

      There is a need to make very small vias for PC (251P) cards
that are very thin in thickness, e.g., high density card (HDC) is
only .006 to .015 inch thick.  The present state-of-the-art in
drilling or punching vias is .0035 to .004 inch in diameter.  For the
high density applications, vias as small as .001 are required.

      This device incorporates the principle of magnetic repulsion to
get a small missile up to high enough velocity to penetrate PC boards
with aspect ratios thickness to diameters of 20 or 30 to 1.  The
device generates a traveling magnetic wave that "pushes" the missile
like an ocean wave pushes a surfer.

      The traveling magnetic wave is created by a polyphase winding
in which each phase is made of small consecutive sections, each being
driven by capacitors.  The traveling magnetic wave is the result of
the resonance energy transfer between particular sections of a stator
phase and travels longitudinally with an increasing velocity:
 Vtw = 2Tf
where T is the polar pitch and f is the frequency of currents
creating the traveling wave.

      In order to obtain an increasing longitudinal velocity, the
resonant frequency of oscillation between subsequent stator coils and
their corresponding lapicators must be increased con...