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Browse Prior Art Database

Chip Temperature Monitoring Device

IP.com Disclosure Number: IPCOM000101955D
Original Publication Date: 1990-Sep-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Buliszyn, S: AUTHOR [+2]

Abstract

Disclosed is a measurement device to precisely monitor chip temperatures on an encapsulated TCM.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Chip Temperature Monitoring Device

       Disclosed is a measurement device to precisely monitor
chip temperatures on an encapsulated TCM.

      In Fig. 1, thermocouple 1 is embedded in piston 2 via a
machined hole in the piston and thermally conductive epoxy, whose
thermal conductivity is similar to that of the machined piston
material.  Also shown in Fig. 1 is the chip 5 and piston spring 6 as
the assembly is mounted in the hat 3.

      In Fig. 2, the thermocoupled piston 7 is shown mounted in a hat
3 with the leads exiting port 4.  The leads are sealed in the port
using a silicon adhesive, such as RTV 102*.  As the piston contacts
the chip due to the piston spring force during encapsulation, heat
transfer occurs at a known rate between the thermocoupled piston and
chip.  The embedded thermocouple senses this heat transfer in the
form of temperature at the piston which is directly related to the
chip temperature.  Thus, by measuring the piston temperature, chip
temperature can be determined very easily through a simple thermal
relationship.
*  Trademark of General Electric Company.