Browse Prior Art Database

High-Density Arm Electronics Package for Disk Drive

IP.com Disclosure Number: IPCOM000101974D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

Vettel, GM: AUTHOR

Abstract

An electronic packaging concept for the actuator arm electronics in high-density hard disk drives. Head lead wires have increased along with more complex servo and read/write electronics. The density of wiring and interconnects has increased beyond the capability of past packaging techniques. The method described addresses these problems.

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High-Density Arm Electronics Package for Disk Drive

       An electronic packaging concept for the actuator arm
electronics in high-density hard disk drives.  Head lead wires have
increased along with more complex servo and read/write electronics.
The density of wiring and interconnects has increased beyond the
capability of past packaging techniques.  The method described
addresses these problems.

      A multi-level wiring substrate 1 (see the figure) is used as a
space transformer between the head lead attachment pads 2 and the
input/output lines of the arm electronic semiconductor chips 4.  It
also provides interconnect pads 3 for the arm electronics to the
actuator flex cable 7.  In addition, the substrate 1 is the carrier
for the arm electronic chips 4 and all the supporting passive
components 8.

      This method gives a well-defined closely spaced row of pads 2
to facilitate connection of the head lead wires 9. These can be
attached by wire bonding, soldering, conductive polymers or any
interconnect system that would be compatible with the lead wires and
substrate pads.

      There is a reduced number of leads going between the arm
electronics semiconductor chips 4 and the actuator flex cable 7.
These leads are routed to the bottom side of the substrate for
interconnection 3 to the actuator flex cable 7.  This allows for a
reliable interconnect system to the flex without subtracting from the
component mounting space on the top surface.

   ...