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Browse Prior Art Database

Thermocouple Laser Sonic Bonder Tip

IP.com Disclosure Number: IPCOM000102020D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Hodgson, RT: AUTHOR [+2]

Abstract

This article concerns a method for fabricating a laser-powered ultrasonic bonding tip incorporating an integral thermocouple which acts to measure the bonding tip temperature before, during and after a wire bonding operation.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 83% of the total text.

Thermocouple Laser Sonic Bonder Tip

       This article concerns a method for fabricating a
laser-powered ultrasonic bonding tip incorporating an integral
thermocouple which acts to measure the bonding tip temperature
before, during and after a wire bonding operation.

      An accurate means for measuring tip temperature during the wire
bonding process will allow for better assessment and control of
eventual bond strength.  An existing laser bonder tip 1, shown in
Fig.  1, results from modification of a conventional ultrasonic
bonder tip to accept an optical fiber 2 which carries a laser beam to
heat the tip.  A tip, identical in physical dimensions to that shown
in Fig. 1, but incorporating a bimetal thermocouple junction at the
end of the tip, can be fabricated in the following manner. Referring
to Fig. 2, a tip similar to that previously shown but with slightly
smaller outside dimensions, may be made by conventional means, such
as a holder having appropriate conductor and insulators or
appropriate force-fit connections.  An insulator 4, such as alumina,
having about the same coeffi cient of expansion as tungsten, is then
deposited on the outside of the tungsten tip 3 by chemical vapor
phase deposition.  The end of the tip 5 is then ground off and
another metal 6, such as osmium, is plated on the outside of the tip
by seeding with palladium (approximately 50 Angstroms thick) and
electroless plating or dry chemical vapor deposition.  The mandrel 8
is then d...