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Blunt Tip Probe Picking

IP.com Disclosure Number: IPCOM000102036D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 3 page(s) / 88K

Publishing Venue

IBM

Related People

Hado, E: AUTHOR [+3]

Abstract

The wafer finishing process presently involves mounting a wafer to a low tack tape that is radially stretched across a rigid stainless steel frame. The wafer is then processed through a dicing operation to separate the individual chips. These chips are picked off the wafer and are then placed into a protective carrier.

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Blunt Tip Probe Picking

       The wafer finishing process presently involves mounting a
wafer to a low tack tape that is radially stretched across a rigid
stainless steel frame.  The wafer is then processed through a dicing
operation to separate the individual chips. These chips are picked
off the wafer and are then placed into a protective carrier.

      The picking industry typically uses a hold down ring, anvil,
and a needle cluster in order to remove the chip off the low tack
tape.  The anvil is used to support the chip, while the hold down
ring is used to keep the adjacent chips in place.  The needle
cluster, consisting of 4 needles, is lifted in such a manner that it
punctures the tape and lifts the chip off the taped frame.  This
puncturing of the tape results in a tape residue ("tape dots") on the
order of 3-5 mils being left on the backside of the chips.

      The need to eliminate the presence of the tape dots leads to
the development of the Blunt Tip Probe for chip picking.

      SUMMARY OF OPERATION The Blunt Tip Probe is a piece of hardware
that replaces the industry standard needle cluster as a method of
picking chips.  Operation of the Blunt Tip Probe is as follows:
1)   Chip is positioned over the Blunt Tip Probe.
2)   Vacuum is applied to the vacuum table (Fig. 1) causing the
tape-mounted device chips to be pulled down, holding them in a fixed
position.
3)   An overhead pickup probe is positioned above the chip to be
picked.
4)   The pick...