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Browse Prior Art Database

Photoresist Adhesion Repair Binder

IP.com Disclosure Number: IPCOM000102072D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Collini, GJ: AUTHOR [+2]

Abstract

Disclosed is a material and process which permits the repair of photo-resist adhesion from faults that would normally cause failure during further processing. The process entails spincoating a BINDER material onto the patterned wafer, a bake and a mild plasma ash. The major application of this technology is to correct situations where partial photoresist stencil delamination has occurred during the photoresist develop step, prior to a wet chemical etch of the material of the wafer surface.

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This is the abbreviated version, containing approximately 52% of the total text.

Photoresist Adhesion Repair Binder

       Disclosed is a material and process which permits the
repair of photo-resist adhesion from faults that would normally cause
failure during further processing.  The process entails spincoating a
BINDER material onto the patterned wafer, a bake and a mild plasma
ash.  The major application of this technology is to correct
situations where partial photoresist stencil delamination has
occurred during the photoresist develop step, prior to a wet chemical
etch of the material of the wafer surface.

      The technique works in the following fashion:
      (1)  After development, rinsing and drying of the patterned
photo-resist of poor adhesion, there exists a thin separation between
the bottom of the resist and the substrate (Example:  1.0 mm of a
novolak resin-based photoresist, patterned on 2 mm of sputtered
quartz with no adhesion preparation.)
   (2)  A dilute solution of the BINDER SOLUTION is spun-coated onto
the wafer.  The solution is drawn by "capillary action" into the
cracks and voids of between the resist stencil (caused by the failed
adhesion), and the wafer and also coats the entire surface of the
resist.  The BINDER SOLUTION is cast out of a solvent which does not
dissolve the imaged photoresist.  Therefore, the resist stencil is
not eroded, washed away, thinned, swollen or distorted in shape by
spincoating on the binder.  The BINDER consists of a polymer which is
capable of being crosslinked by an easily assessable process, and
will not damage the substrate or resist layers.  (Example:  4%
novolak resole in chloroto- luene spun-coated at 4 K rpm.)
 (3)  The wafer is baked at a temperature below t...