Browse Prior Art Database

Temperature-Activated Heatsink

IP.com Disclosure Number: IPCOM000102113D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Lamb, CR: AUTHOR

Abstract

Disclosed is a cooling device designed to control silicon chip operating temperatures over a range of electric powers. This is accomplished by changing the heatsink fin orientation to the directional flow of the cooling media during chip operation. As chip powers increase, the device senses the increase in temperature and increases the effective cooling surface area. This limits the amount of temperature rise in the silicon chip. As chip powers are reduced, the process reverses and thereby limits the operating temperature range. As shown in the figure, bimetallic heatsink fins are used to accomplish the orientation change. While a ceramic module is used to illustrate this idea, it is applicable to other silicon chip packages.

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Temperature-Activated Heatsink

       Disclosed is a cooling device designed to control silicon
chip operating temperatures over a range of electric powers. This is
accomplished by changing the heatsink fin orientation to the
directional flow of the cooling media during chip operation.  As chip
powers increase, the device senses the increase in temperature and
increases the effective cooling surface area.  This limits the amount
of temperature rise in the silicon chip.  As chip powers are reduced,
the process reverses and thereby limits the operating temperature
range.  As shown in the figure, bimetallic heatsink fins are used to
accomplish the orientation change.  While a ceramic module is used to
illustrate this idea, it is applicable to other silicon chip
packages.