Browse Prior Art Database

Compressible-Contact Interconnection Scheme

IP.com Disclosure Number: IPCOM000102127D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Puttlitz, KJ: AUTHOR [+2]

Abstract

A high-density interconnection scheme is disclosed which utilizes compressible contact elements.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 81% of the total text.

Compressible-Contact Interconnection Scheme

       A high-density interconnection scheme is disclosed which
utilizes compressible contact elements.

      A typical embodiment consists of free-standing (non-attached)
microbellows, as depicted in Fig. 1.  An interposer 1 serves to space
and maintain the location of individual compressible elements 2 as
required for a specific application.  It also serves as a guide and
support during elastic deformation to avoid "straying" (bending
sideways).  The compressible elements make contact with the board 3
at one end, and the module 4 at the opposite end.

      Other variations or modifications are possible, some of which
are illustrated in Fig. 2.  The compressible elements may be attached
7 with solder, braze, adhesive, etc., to module 4 and/or board 3.
The free end serves as the surface contact 6 or held in position by
some suitable method, e.g., cradle or bump 5.

      An interposer may not be required when one end of the
compressible contact is permanently attached.

      Compressible elements (e.g., bellows, springs, etc.) can be
modified to increase contact reliability.  For example, soft metal
pads 6 may be attached to one or both ends (Figs. 1 and 2).
Compressible ele ments may also be combined, e.g., set of concentric
springs. Tolerance variations can easily be accommodated owing to the
various combinations of compressible elements, modifications, and
attachment techniques assuring an elastic r...