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Attachment of a Flexible Film Chip Carrier to a Pinned Interposer

IP.com Disclosure Number: IPCOM000102147D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Busacco, RA: AUTHOR [+5]

Abstract

An integral copper strap extending across a hole in the film dielectric and connecting the two sides of the circuit land surrounding the hole (Fig. 1) insures the formation of a reliable solder connection between the flexible film chip carrier and a pinned interposer used to provide the I/O connections to a circuit card or board. The strap provides a natural place for the solder to adhere and wick up to wet the land area around the hole. This eliminates the possibility of the solder not bridging the space, created by the thickness of the thin film dielectric, between the pin head and the land.

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Attachment of a Flexible Film Chip Carrier to a Pinned Interposer

       An integral copper strap extending across a hole in the
film dielectric and connecting the two sides of the circuit land
surrounding the hole (Fig. 1) insures the formation of a reliable
solder connection between the flexible film chip carrier and a pinned
interposer used to provide the I/O connections to a circuit card or
board.  The strap provides a natural place for the solder to adhere
and wick up to wet the land area around the hole.  This eliminates
the possibility of the solder not bridging the space, created by the
thickness of the thin film dielectric, between the pin head and the
land.

      For a two-layer flexible film, a double-strap design can be
used to provide a via connection between the top and bottom layers
(Fig. 2).  The strap is placed across the hole on both the top and
bottom layers (non-overlapping) and the via connection is assured
when the solder joint is formed around both top and bottom straps.