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Molded Flat Fold-Up Cover Enclosure

IP.com Disclosure Number: IPCOM000102154D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Related People

Davis, MF: AUTHOR [+2]

Abstract

A technique is described whereby a molded flat fold-up cover enclosure is shipped with a host product in a flat compact form, then assembled by the user and used as an enclosure for the protection of subassemblies, cable harnesses, etc.

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Molded Flat Fold-Up Cover Enclosure

       A technique is described whereby a molded flat fold-up
cover enclosure is shipped with a host product in a flat compact
form, then assembled by the user and used as an enclosure for the
protection of subassemblies, cable harnesses, etc.

      The molded flat fold-up cover enclosure, as shown in the
figure, is designed to be shipped flat within the same enclosure as
the product. It eliminates the need for a separate carton when a
separate enclosure is needed by the customer for protection or other
purposes.

      The design is such that the enclosure can be molded with a full
medium texture and yet be assembled in a "squared off" (90o bends) so
as to achieve maximum internal space when assembled.  Typically, the
usual molded enclosure form would require a five-degree draft at the
corners in order to obtain the required mold release of the medium
texture.

      The enclosure utilizes a living hinge design which allows
shipment in flat form.  When the enclosure is snapped together, the
enclosure becomes a rigid three-dimensional product.  Generally, a
material such as polypropoline, flexible PVC or the equivalent can be
used.