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Browse Prior Art Database

Polyimide Surface Modification for Adhesion Improvement

IP.com Disclosure Number: IPCOM000102155D
Original Publication Date: 1990-Oct-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

DeLeo, J: AUTHOR [+5]

Abstract

Disclosed is a technique for polyimide surface activation to provide improved polyimide-to-polyimide adhesion in the fabrication of multilayer metal structures using polyimide interlevel dielectric. The method involves controlled hydrolysis of cured polyimide surface by exposure to aqueous or alcoholic solution of an organic base or oligomerized 3-aminopropyl triethoxysilane (A1100) in a basic solution, followed by water rinse and bake to 75-85oC prior to application of the second polymer layer. This technique provides major improvement in self-adhesion of polyimide layers in that peel values higher than 85 g/mm have been obtained in the case of PMDA-ODA polyimide.

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Polyimide Surface Modification for Adhesion Improvement

       Disclosed is a technique for polyimide surface activation
to provide improved polyimide-to-polyimide adhesion in the
fabrication of multilayer metal structures using polyimide interlevel
dielectric.  The method involves controlled hydrolysis of cured
polyimide surface by exposure to aqueous or alcoholic solution of an
organic base or oligomerized 3-aminopropyl triethoxysilane (A1100) in
a basic solution, followed by water rinse and bake to 75-85oC prior
to application of the second polymer layer.  This technique provides
major improvement in self-adhesion of polyimide layers in that peel
values higher than 85 g/mm have been obtained in the case of PMDA-ODA
polyimide.

      Use of polyimide insulator in microelectronics generally
involves fully curing the polyimide before building the next level so
as to minimize outgassing during reactive-ion etching and/or high
temperature metallization steps.  It is commonly known that high Tg
fully cured polyimides, such as PMDA-ODA which is derived from
pyromellitic dianhydride and 4,4'-oxydianiline polyamic acid
precursor, have poor interlayer adhesion (5-10 g/mm) when the second
layer is processed on the first fully cured layer with no prior
surface activation.

      According to the method disclosed here, polyimide surface is
activated by a short time treatment with 2-5% alcoholic or aqueous
solution of an organic base, such as pyridine, aqueous ammonia,...