Browse Prior Art Database

Cooling of Integrated Circuits using Tape Automated Bonding

IP.com Disclosure Number: IPCOM000102282D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 4 page(s) / 109K

Publishing Venue

IBM

Related People

Mansuria, MS: AUTHOR [+4]

Abstract

Described are three methods for cooling integrated circuit (IC) packages. Each method provides a means of maintaining a maximum chip operating temperature in the range of 25oC so as to enable an IC to operate up to twenty percent faster. The additional cooling also increases the life and reliability of the IC.

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Cooling of Integrated Circuits using Tape Automated Bonding

       Described are three methods for cooling integrated
circuit (IC) packages.  Each method provides a means of maintaining a
maximum chip operating temperature in the range of 25oC so as to
enable an IC to operate up to twenty percent faster. The additional
cooling also increases the life and reliability of the IC.

      The concept utilizes the coupling of tape automated bonding
(TAB) with thermal electric cooler (TEC) products. Three methods of
coupling involve:  a) a TAB/TEC assembly mounted to an integrated
thermal path (Fig. 1); b) a TAB mounted to a card integrated TEC
assembly (Fig. 2); and c) a TAB/TEC assembly mounted to an integrated
heat sink (Fig. 3). In each method, the assembly can be joined to a
circuit board utilizing standard metal features for thermal
spreading, or can be mounted to a heat sink.

      In the first method, as shown in Fig. 1, a TEC hot plate is
used between the thermal grease and the TEC elements.  In the second
method, as shown in Fig. 2a, the separate TEC hot plate used in Fig.
1 is eliminated.  Instead, a stitch pattern is used.  Fig. 2b
illustrates the integration of the TEC hot plate, power connection
and stitch pattern.  Fig. 2c shows the bottom view of the TEC cold
plate, and Fig. 2d illustrates the TEC stitch pattern top view with
power lines coming directly into the circuit board.  N and P junction
TEC elements can be added to the circuit board and...