Browse Prior Art Database

Ballpoint Hat for Single Point ILB/OLB

IP.com Disclosure Number: IPCOM000102335D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Hernandez, B: AUTHOR [+4]

Abstract

TAB is being used more and more to provide interconnections from silicon chips containing microcircuits to the next level of package. The I/O connections on the chip level (ILB) can be made by reflowing a solder in the presence of the metal lands contained in the TAB tape or flex. The reflow can be accomplished by aligning the solder pads and metal beams, with numbers approaching 400, and using a HAT (Hot Air Thermode) to direct a stream of hot gas and simultaneously effect the joining of all the I/Os. The dimensions of the metal lands (.003 inch wide by .001 inch thick while having unsupported lengths of .040 inch) make these extremely fragile and subject to being at times out of registration, both laterally and in a planar manner.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 70% of the total text.

Ballpoint Hat for Single Point ILB/OLB

       TAB is being used more and more to provide
interconnections from silicon chips containing microcircuits to the
next level of package.  The I/O connections on the chip level (ILB)
can be made by reflowing a solder in the presence of the metal lands
contained in the TAB tape or flex.  The reflow can be accomplished by
aligning the solder pads and metal beams, with numbers approaching
400, and using a HAT (Hot Air Thermode) to direct a stream of hot gas
and simultaneously effect the joining of all the I/Os.  The
dimensions of the metal lands (.003 inch wide by .001 inch thick
while having unsupported lengths of .040 inch) make these extremely
fragile and subject to being at times out of registration, both
laterally and in a planar manner.

      To repair the beams that are not joined requires a method that
will place these beams back in location and at the same time not
reflow the solder joints adjacent to the bond to be repaired.  The
tool and procedure described here will repair TAB and other flex,
both ILB and OLB, while at the same time allowing initial bonding to
take place.

      The OLB is aligned with the mating solder pads, and an
appropriate method is used to allow the HAT body to coincide with
these mated structures.  Nitrogen is heated in the HAT heater
assembly and allowed to flow through the HAT nozzle. The ballpoint
plunger at the nozzle exit will inhibit the flow as the tapered
portion of the plu...