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Browse Prior Art Database

Wafer Monitor Retrieval Assembly for High Vacuum Equipment

IP.com Disclosure Number: IPCOM000102374D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 3 page(s) / 85K

Publishing Venue

IBM

Related People

Brown Jr, WW: AUTHOR [+4]

Abstract

The wafer monitor retrieval assembly mechanism described in this article eliminates the present need to vent an entire vacuum system while removing and checking a wafer monitor for proper sputter removal and/or film thickness. Continued

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This is the abbreviated version, containing approximately 59% of the total text.

Wafer Monitor Retrieval Assembly for High Vacuum Equipment

       The wafer monitor retrieval assembly mechanism described
in this article eliminates the present need to vent an entire vacuum
system while removing and checking a wafer monitor for proper sputter
removal and/or film thickness. Continued

      An "in-line evaporator" is efficient only if it can be run for
many hours in a row since the first full cycle requires 1.5 hours and
subsequent cycles take only 0.5 hours to complete.  If the machine is
stopped for any reason the cycle time of all three chambers is
drastically altered and the throughput decreased by up to 35%.  By
use of the disclosed Wafer Monitor Retrieval Assembly, minimum cycle
time plus maximum throughput can be achieved, while eliminating the
risk of losing up to 51 wafers, i.e., three runs of 17 wafers each.

      This mechanism consists of a rotary linear ferrofluidic feed
through attached to a lock chamber and valve assembly which is
connected to, but can operate independently of, the process chamber.
Because of this independence and its isolation from the process
chamber, this assembly allows for the transfer of an etch monitor
wafer from the vacuum chamber (under high vacuum) without disturbing
the vacuum or interrupting the normal machine cycle.  This assembly
can be constructed and installed on conventional vendor-built,
in-line evaporators (ULVAC) as well as on standard box coaters.

      Figs. 1 and 2 illustrate iden...