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Method of Producing a Movable Micro Machine Element in a Solid Element and having Controlled Tolerance Between Elements

IP.com Disclosure Number: IPCOM000102424D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Cronin, JE: AUTHOR

Abstract

Very large-scale integrated circuit (VLSI) process technology is used to create movable micromachine elements having close dimensional tolerance to other elements. As an example, an element is formed having a permitted degree of freedom to move but is retained within a solid substrate. The tolerance of fit between the movable element and its retainer may be very small using these processes.

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Method of Producing a Movable Micro Machine Element in a Solid Element and having Controlled Tolerance Between Elements

       Very large-scale integrated circuit (VLSI) process
technology is used to create movable micromachine elements having
close dimensional tolerance to other elements.  As an example, an
element is formed having a permitted degree of freedom to move but is
retained within a solid substrate. The tolerance of fit between the
movable element and its retainer may be very small using these
processes.

      Referring to the cross section in Fig. 1, a trough, having
recursive sidewalls, is etched in substrate 10. Then, separator
material 12 is deposited conformally. Material 14 is deposited to
fill the opening.

      A planarizing process is used to create the cross section shown
in Fig. 2.  Selective etching of separator material 12 leaves movable
part 12 retained in the trough in substrate 10.

      Thus, a one-piece mold is used to cast a movable part within a
guidance retainer slot in a substrate.  Fit between the movable
element and its guidance retainer may be held to tolerances
appropriate to the size and action of the micromachine being
constructed.