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Browse Prior Art Database

Wet Application of Dry Film Photoresist Using an Atomizing Chamber

IP.com Disclosure Number: IPCOM000102471D
Original Publication Date: 1990-Nov-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

De Boldt, BA: AUTHOR [+4]

Abstract

Disclosed is a process for wet application of aqueous photoresist to printed circuit boards, with and without plated through holes, by using an atomizing chamber to apply a water vapor film.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 74% of the total text.

Wet Application of Dry Film Photoresist Using an Atomizing Chamber

       Disclosed is a process for wet application of aqueous
photoresist to printed circuit boards, with and without plated
through holes, by using an atomizing chamber to apply a water vapor
film.

      This method improves the ability to control water distribution
on panel surfaces, reduces surface contamination during photoresist
application by eliminating contact with the wet apply system, and
does not force water into the plated through holes.  The wet apply
roller systems available today apply a sheet of water that enables
water droplets to become entrapped in the plated through holes of
multilayer boards when the panel comes into contact with the rollers.
Water entrapment in these holes can lead to degradation of the
photoresist tent that protects the plated hole during etching.
Improved conformation of the photoresist to the copper substrate
through the use of the conventional wet lamination systems improves
inner layer etch yields.  The atomizing or humidifying method makes
the yield benefits of wet lamination possible for the external
planes.

      Wet photoresist lamination by means of a fogging chamber uses
atomizing or humidifying nozzles in an enclosed chamber (see the
figure).  The chamber 1 consists of a water (hot or ambient) supply
5, two or more fogging nozzles 3, a means of controlling the water
flow rate 10, a means of exhaust 6, and a drain 7.  Commercially
available...