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High Efficiency Radiation Hole With Metal Core Printed Wiring Board

IP.com Disclosure Number: IPCOM000102569D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 4 page(s) / 134K

Publishing Venue

IBM

Related People

Endoh, S: AUTHOR [+2]

Abstract

Disclosed is the construction and manufacturing method for heat radiation hole with metal core printed wiring board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 78% of the total text.

High Efficiency Radiation Hole With Metal Core Printed Wiring Board

       Disclosed is the construction and manufacturing method
for heat radiation hole with metal core printed wiring board.

      The construction process is:
      a) The heated component, e.g. silicon chip, diode, FET, or
transistor etc., is mounted on the radiation land, i.e., Cu plating
and foil, which directly connects to the metal core through the
radiation hole.
 b) The radiation hole directly conducts the heat of the component to
the chassis with screw or rivet.

      In the structure:
      1) The material of metal core is copper. The radiation land is
established on component side.  It connects to the metal core through
the radiation hole, formed by copper non-electrolyze and electrolyze
plating.
 2) The material of metal core is steel. The steel surface is plated
with copper.
 3) The material of metal core is aluminum. The radiation hole is
established in the radiation land on component side.  Aluminum oxide
or copper powder is filled up in this radiation hole and burned to
connect between this land and metal core.

      Fig. 1 shows the mounting of silicon chip with wire bonding on
metal core of copper or copper plating steel. The diameter of
radiation hole is about 0.5 mm.  Fig. 2 shows the mounting of silicon
chip with wire bonding on metal core of aluminum.  The diameter of
radiation hole is the rang from 0.7 to 0.8 mm due to filling up with
powder.  The...