Browse Prior Art Database

Direct Chip Bonding for Liquid Crystal Display

IP.com Disclosure Number: IPCOM000102620D
Original Publication Date: 1990-Dec-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Sakamoto, K: AUTHOR [+3]

Abstract

Disclosed is a technique for interconnecting driver IC chips directly on the surface of a glass substrate. This technique is widely applicable to all hybrid devices and flat panel displays.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Direct Chip Bonding for Liquid Crystal Display

       Disclosed is a technique for interconnecting driver IC
chips directly on the surface of a glass substrate.  This technique
is widely applicable to all hybrid devices and flat panel displays.

      To achieve interconnection, as shown in the figure, the
structure disclosed herein uses a Transferred Anisotropic Conducting
Adhesive (T-ACA), gold bumps fabricated upon IC chip's electrodes and
metal pads on an LCD substrate.  The T-ACA consists of epoxy resin
and nickel particles with spindles.

      T-ACA is printed by transferring on tops of gold bumps with
controlled thickness.

      Interconnection is achieved by applying pressure and heat.
Pressure enables the nickel particle's spindle to penetrate into the
gold bump and the metal pads.  Then, heat cures the epoxy resin to
maintain the interconnection. After this process, encapsulation resin
is injected between chips and LCD substrate for humidity prevention.

      With this structure, high insulation resistance between
adjacent pads and high electrical conductivity interconnection is
achieved.