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Browse Prior Art Database

Integrated Modular System

IP.com Disclosure Number: IPCOM000102738D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 53K

Publishing Venue

IBM

Related People

Dietsch, HE: AUTHOR [+2]

Abstract

To allow easy assembly of pretested chips on multiple chip boards into a temperature-compensated system level wiring array board and to facilitate repair/replacement, semiconductor chips are mounted on boards of uniform construction and size. The chip boards are held in the wiring array board and make electrical connections by means of a system of clamped elastomeric connectors.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 87% of the total text.

Integrated Modular System

      To allow easy assembly of pretested chips on multiple chip
boards into a temperature-compensated system level wiring array board
and to facilitate repair/replacement, semiconductor chips are mounted
on boards of uniform construction and size.  The chip boards are held
in the wiring array board and make electrical connections by means of
a system of clamped elastomeric connectors.

      Referring to the figure, wiring array board 2 has chip boards
4, with chips 6 mounted on them, installed in array board 2 and held
in place by means of connector clamps 8. Other semiconductor modules
which complete the board and the standard board connector are not
shown.

      Cross-section A-A shows that temperature-compensated wiring
board 2 is comprised of a ground plane 10 and two levels of wiring 12
and 14 on each side of ground plane 10. Insulation separates wiring
layers 12 and 14 and ground plane 10 except where interconnection
between individual wires of level 12 is made to wires in level 14.
In the case shown, wiring level 12 comprises a chip interconnection
bus and wiring level 14 is connected to form an orthogonal system
bus.  Chips 6 are shown solder bonded to wiring 16 on chip board 4,
but may be wire bonded instead.  Chip board 4 has a sloped edge 18
which fits under an oppositely sloped edge 20 of an opening in wiring
array board 2 which accommodates chip board 4.  The opposite end of
chip board 4 is held in place by connector...