Browse Prior Art Database

Automated Removal of Soldered Pin Components From Circuit Cards

IP.com Disclosure Number: IPCOM000102740D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 56K

Publishing Venue

IBM

Related People

Williams, DJ: AUTHOR

Abstract

To automatically remove components soldered to circuit cards, a thermally driven component extractor is used to separate modules from cards after solder is melted in a vapor phase soldering apparatus.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 79% of the total text.

Automated Removal of Soldered Pin Components From Circuit Cards

      To automatically remove components soldered to circuit cards, a
thermally driven component extractor is used to separate modules from
cards after solder is melted in a vapor phase soldering apparatus.

      Referring to the figure, extractors of the type shown are
attached to modules 10 to be removed from a board 12. The extractor
is an assembly comprised of lifter brackets 14, board pusher bar 16,
thermally actuated piston 18, hinged bracket lifter 20, and spring
loaded bar 22.  Piston 18 contains a material which is liquid from
room temperature up to a temperature just below solder melting point
and boils at that temperature, causing the piston to expand and
create force tending to separate lifter 20 from bar 16.  The bottom
of piston 18 is fastened to bar 16 and lifter 20 is fastened to the
top of piston 18.  As shown, the piston is in the contracted (low
temperature) condition.

      In application, lifter brackets 14 are pinched together at the
top, thus separating or opening brackets 14 at the bottom which may
then be placed down and under a module 10 to be removed.  When
extractors have been attached as shown to all modules to be removed,
the board 12 with extractors attached to modules is lowered into a
standard vapor phase soldering apparatus. Soldered pins 24 first
reach the solder melting zone and, as board 12 is lowered still
further, piston 18 comes into the solder melting z...