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Fluoride Catalized Hc1 Solution for Rapid Removal of Sacrificial Aluminum Foil Used As a Support for Cast Polyimide Films

IP.com Disclosure Number: IPCOM000102748D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Spalik, J: AUTHOR

Abstract

Ferric chloride solutions are commonly used in the etching of sacrificial aluminum foils used as support on polyimide film surfaces. However, these solutions are limited in application as they deplete rapidly, form precipitates and leave particle contamination and haze on the film.

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Fluoride Catalized Hc1 Solution for Rapid Removal of Sacrificial Aluminum Foil Used As a Support for Cast Polyimide Films

      Ferric chloride solutions are commonly used in the etching of
sacrificial aluminum foils used as support on polyimide film
surfaces.  However, these solutions are limited in application as
they deplete rapidly, form precipitates and leave particle
contamination and haze on the film.

      Aluminum foil can also be dissolved by oxidation to A13+ in
aqueous media.  However, the surface and the polyimide interface
react slowly causing incomplete or slow aluminum removal.  Using
ferric chloride solutions exacerbates the problem because of
hydroxide formation as H+ ion is depleted.

      It has been noted that hydrochloric acid solutions to which 1%
NaF has been added effectively dissolve the foil, leaving a clean
polyimide surface.  Dissolution times at given temperatures and
concentrations are well characterized and predictable.  Dissolution
times as a function of solution depletion are also predictable.

      Disclosed anonymously.