Browse Prior Art Database

Forming Standoffs for Fine Pin Grid Array Ceramic Substrates

IP.com Disclosure Number: IPCOM000102757D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Related People

Hansen, BJ: AUTHOR [+2]

Abstract

A forming tool, Fig. 2, provides a standoff A in the four corner pins 1 of a pinned ceramic substrate carrier 2, Fig. 1.

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Forming Standoffs for Fine Pin Grid Array Ceramic Substrates

      A forming tool, Fig. 2, provides a standoff A in the four
corner pins 1 of a pinned ceramic substrate carrier 2, Fig. 1.

      The tool is provided with the standoff form geometry, e.g., by
grinding it into the hardened steel nest and die block jaws 3 and 4,
respectively, of tool 5, Fig. 2.

      In operation, a corner pin 1, in which the standoff A is to be
formed, is appropriately placed between the open nest and die block
jaws 3 and 4.  Jaws 3 and 4 are then moved laterally, i.e., closed,
to effect a "coining" of the standoff A in the pin 1.  By using this
technique, the length of each corner pin 1 is not shortened
drastically and thus can be substantially the same length as other
pins 6 of the array, cf. Fig. 1.

      Disclosed anonymously.