Browse Prior Art Database

New Products Test Interposer

IP.com Disclosure Number: IPCOM000102758D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Krawczyk, RJ: AUTHOR

Abstract

Disclosed is a method for fabricating an interposer-type test head to perform electrical testing of printed circuit cards and boards prior to component assembly.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

New Products Test Interposer

      Disclosed is a method for fabricating an interposer-type test
head to perform electrical testing of printed circuit cards and
boards prior to component assembly.

      The interposer is built as a mirror-image printed circuit of
the circuit to be tested.  Only the points to be contacted, however,
are present (e.g., lands and tabs, not lines).

      These lands and tabs are then coated with a suitable contact
material, e.g., palladium or other metallic dendrites, or cone-con
technology, to make electrical contact to the corresponding test
points.

      Through-hole connection to internal planes allows fanout of the
test points to plug-type connectors attacked at the edge(s) of the
interposer to provide for rapid connection to the tester circuitry.

      A structural foam backing is utilized to provide uniform
pressure to all test points and compensate for tested card warpage.

      Figure 1 demonstrates the external construction of the test
interposer.

      Disclosed anonymously.