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Grounding Printed Circuit Assembly With Commoning Bars

IP.com Disclosure Number: IPCOM000102759D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 40K

Publishing Venue

IBM

Related People

Rogers, PM: AUTHOR [+3]

Abstract

Disclosed is a method to electrically ground a printed circuit assembly to the machine frame using pre-existing surface copper.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Grounding Printed Circuit Assembly With Commoning Bars

      Disclosed is a method to electrically ground a printed circuit
assembly to the machine frame using pre-existing surface copper.

      Referencing the attached figure, the invention consists of a
printed circuit card (1) with external copper bars (5) connected to a
copper internal ground plane (not shown) by using plated through
holes (4).  These external bars (5) are in turn connected by rivets
(8), or similar devices to conductive insertion/extraction levers (6)
which make contact with a conductive frame (7) when the card (1) is
seated.

      The new feature of this invention is that the external copper
bars (5) used in this technology for card (1) to machine frame (7)
grounding, in previous technology were used only for electrically
commoning the tabs (3) during the gold plating process and after
removal of a section of the commoning bar (2) were no longer needed.

      The advantage of this invention is that the same space on the
card (1) can be used for two different purposes: plating of tabs and
grounding of the card; thereby optimizing the amount of area
available to the feature card designer.

      Disclosed anonymously.