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Heavy Gold Plated Wires for Engineering Changes ("Improved Gold Plated Bond Wire Connection Technique")

IP.com Disclosure Number: IPCOM000102761D
Original Publication Date: 1990-Jan-01
Included in the Prior Art Database: 2005-Mar-17
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Schmeckenbecher, AF: AUTHOR [+2]

Abstract

This article describes an improved procedure for compression bonding gold plated copper wires to engineering change (EC) pads on alumina substrates.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 86% of the total text.

Heavy Gold Plated Wires for Engineering Changes ("Improved Gold Plated Bond Wire Connection Technique")

      This article describes an improved procedure for compression
bonding gold plated copper wires to engineering change (EC) pads on
alumina substrates.

      A gold plated copper wire having a diameter in the order of 25
- 35 uM is now employed (with compression bonding) to connect
engineering change (EC) pads residing on the top of MLC (multi-layer
ceramic) substrates to backside contacts.  This procedure is labor
intensive, time consuming and costly, requiring that the EC pads
initially be electroplated with a heavy gold layer (N 3-10 uM thick).

      The disclosed procedure avoids the present multiple masking and
plating steps involved in the current heavy gold plating of the EC
pads, and requires considerably less gold and processing time to
produce reliable EC pad connections. A special bonding wire is used
instead, one coated with a layer of gold (N 3-10 uM thick).  The gold
is protected by an insulating layer which is removed during the wire
bonding operation.  Heavy gold is much easier plated to the wire than
to the EC pads.  This wire may be flattened by passing it between
rollers, etc., following the plating process step, thereby providing
a larger contact area for wire bonding.

      With the disclosed procedure, the present multiple masking and
plating steps necessary during the heavy gold electroplate of the EC
pads may be avoided. ...